{"id":380412,"date":"2026-10-09T02:48:00","date_gmt":"2026-10-09T09:48:00","guid":{"rendered":"https:\/\/cms-articles.softonic.io\/en\/?p=380412"},"modified":"2026-10-09T02:48:53","modified_gmt":"2026-10-09T09:48:53","slug":"nvidia-could-use-intel-foveros-packaging-in-2028-tsmc-may-still-make-the-gpu-dies","status":"publish","type":"post","link":"https:\/\/cms-articles.softonic.io\/en\/nvidia-could-use-intel-foveros-packaging-in-2028-tsmc-may-still-make-the-gpu-dies\/","title":{"rendered":"NVIDIA could use Intel Foveros packaging in 2028: TSMC may still make the GPU dies"},"content":{"rendered":"

GF Securities analyst Jeff Pu says NVIDIA may turn to Intel\u2019s Foveros advanced packaging<\/strong> in the second half of 2028, while Taiwan Semiconductor Manufacturing Co. (TSMC) continues building the main GPU dies on its leading-edge process nodes.<\/p>\n

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If that happens, Intel\u2019s role would be at the high end of packaging<\/strong>, not as the company making NVIDIA\u2019s flagship compute dies. The likely job is advanced packaging, plus some non-core silicon around the processor.<\/p>\n\n

For NVIDIA, the appeal is pretty clear. It could take some pressure off TSMC\u2019s packaging capacity<\/strong>, spread supply across more than one partner, reduce bottlenecks, and help support future production ramps. For Intel, landing work like this would give real weight to its IDM 2.0 foundry push, which is all about winning business from outside chip designers.<\/p>\n\n

Foveros matters here because it stacks chiplets vertically on top<\/strong> of a base die. That\u2019s different from Intel\u2019s EMIB approach, which links chips side by side. The upside is denser integration in a smaller footprint, along with faster communication between parts, better power efficiency, and stronger interconnect performance.<\/p>\n\n

Anyone who follows AI chips should keep an eye on this. Earlier rumors in 2026<\/strong> tied NVIDIA\u2019s Feynman GPUs to Intel\u2019s 14A or 18A process nodes, and other reports had already connected Intel to backend and foundry work for Google accelerators.<\/p>\n\n

Right now, though, there\u2019s no announced deal<\/strong>. Volumes, product names, revenue impact, and even the final structure are still up in the air, so this reads more like a credible industry signal than a finished contract. Still, if it does come together, it would be one of the clearest signs yet that the noise around Intel\u2019s foundry business is starting to turn into actual business.<\/p>\n

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GF Securities analyst Jeff Pu says NVIDIA may turn to Intel\u2019s Foveros advanced packaging in the second half of 2028, while Taiwan Semiconductor Manufacturing Co. (TSMC) continues building the main GPU dies on its leading-edge process nodes. If that happens, Intel\u2019s role would be at the high end of packaging, not as the company making … Continue reading “NVIDIA could use Intel Foveros packaging in 2028: TSMC may still make the GPU dies”<\/span><\/a><\/p>\n","protected":false},"author":9351,"featured_media":380411,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","wpcf-pageviews":0},"categories":[1015],"tags":[],"usertag":[],"vertical":[],"content-category":[6823],"class_list":["post-380412","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","content-category-games"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/posts\/380412","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/users\/9351"}],"replies":[{"embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/comments?post=380412"}],"version-history":[{"count":1,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/posts\/380412\/revisions"}],"predecessor-version":[{"id":380413,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/posts\/380412\/revisions\/380413"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/media\/380411"}],"wp:attachment":[{"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/media?parent=380412"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/categories?post=380412"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/tags?post=380412"},{"taxonomy":"usertag","embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/usertag?post=380412"},{"taxonomy":"vertical","embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/vertical?post=380412"},{"taxonomy":"content-category","embeddable":true,"href":"https:\/\/cms-articles.softonic.io\/en\/wp-json\/wp\/v2\/content-category?post=380412"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}