{"id":382408,"date":"2026-10-28T11:44:00","date_gmt":"2026-10-28T18:44:00","guid":{"rendered":"https:\/\/cms-articles.softonic.io\/en\/?p=382408"},"modified":"2026-10-28T11:44:03","modified_gmt":"2026-10-28T18:44:03","slug":"cxmt-pushes-ahead-with-hbm3e-limited-production-is-reportedly-two-months-away","status":"publish","type":"post","link":"https:\/\/cms-articles.softonic.io\/en\/cxmt-pushes-ahead-with-hbm3e-limited-production-is-reportedly-two-months-away\/","title":{"rendered":"CXMT pushes ahead with HBM3E: limited production is reportedly two months away"},"content":{"rendered":"

Reuters reports that ChangXin Memory Technologies, or CXMT, China\u2019s largest DRAM maker, plans to begin limited HBM3E production within the next two months<\/strong>. If that happens, China would have a domestic source for the kind of AI memory it needs more and more.<\/p>\n

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The problem is yield. Reuters puts it at 20% to 30%<\/strong>, which means 70% to 80% of the chips fail. Under normal conditions, that\u2019s a tough basis for large-scale production.<\/p>\n\n

HBM3E matters because it sits close to advanced processors and moves huge amounts of data<\/strong> for the accelerators that train and run large models in data centers. Supply is already tight enough that, according to one earlier estimate, a single major U.S. server buildout could require hundreds of thousands of additional DRAM wafers a month, or roughly 40% of global output.<\/p>\n\n

U.S. export controls are part of the story too. The rules introduced in October 2022<\/strong>, then tightened later, have pushed advanced memory higher up China\u2019s priority list by limiting access to top-end chips and some of the manufacturing tools needed to make them.<\/p>\n\n

Analysts have described this as \u201closs-making domestic substitution.\u201d Reuters says Beijing is backing the effort through Made in China 2025, dual circulation, and a reported $47.5 billion<\/strong> chip fund.<\/p>\n\n

If you follow AI hardware, keep an eye on this. CXMT still trails SK Hynix and Samsung<\/a>, and Reuters says its performance is closer to older HBM3. SK Hynix is getting yields near 70%<\/strong>. Samsung is already moving into HBM4 and HBM4E. And the resource cost for each working chip is still high.<\/p>\n

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You can read the report at Reuters.<\/p>","protected":false},"excerpt":{"rendered":"

Reuters reports that ChangXin Memory Technologies, or CXMT, China\u2019s largest DRAM maker, plans to begin limited HBM3E production within the next two months. If that happens, China would have a domestic source for the kind of AI memory it needs more and more. The problem is yield. Reuters puts it at 20% to 30%, which … Continue reading “CXMT pushes ahead with HBM3E: limited production is reportedly two months away”<\/span><\/a><\/p>\n","protected":false},"author":9265,"featured_media":382407,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","wpcf-pageviews":0},"categories":[1015],"tags":[],"usertag":[],"vertical":[],"content-category":[6771],"class_list":["post-382408","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news","content-category-ai"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t